MCL’s Director of Engineering and Technology, Mike Tucker, recently appeared on the OnTrack Podcast, where he shared valuable insights into the challenges that arise during printed circuit board (PCB) production. During the episode, Mike addressed several critical pain points faced by PCB manufacturers and designers, providing clarity on how to navigate these issues effectively.
Inconsistencies in Fabrication Notes and ECOs
Mike Tucker highlighted that inconsistencies between original designs, quote forms, and fabrication notes often lead to manual clarifications with customers, slowing down the production process. This is especially problematic for quick-turn projects.
Engineering Change Orders (ECOs) add another layer of complexity when recurring deviations aren’t tracked effectively, often resulting in miscommunication. Mike emphasized the need for precise documentation and better collaboration between design and engineering teams to avoid costly production delays.
Common Designer Errors
Mike also addressed frequent designer errors, such as copying fabrication notes without understanding their manufacturing impact or relying too heavily on auto-routing, which can lead to tight component spacing. These small mistakes often disrupt production, increasing costs and delays. He advised designers to collaborate closely with manufacturers to ensure their designs are optimized for manufacturability.
The Offshore Disconnect
With PCB manufacturing shifting offshore, designers are often distanced from production facilities, leading to a disconnect between design intent and manufacturing capabilities. This gap, especially in evolving technologies like Ultra HDI, can result in production defects or delays when designers aren’t familiar with specific standards or techniques. Mike stressed the importance of bridging this gap to align design standards with real-world production capabilities.
IPC Standards and Tribal Knowledge
While IPC standards provide guidance, specific knowledge, especially for military and automotive applications, is often passed down informally. Mike recommended working with experienced contract manufacturers to ensure designs meet industry standards, particularly through close communication between designers and PCB process engineers.
Assembly Errors and HDI Challenges
Assembly errors, particularly around panelization, often arise from poor communication between designers, fabricators, and assembly teams. With the shift toward HDI and UHDI technology, issues such as varying pad size requirements add new challenges, especially during mass production if these changes aren’t caught early. Mike urged better communication and understanding of assembly requirements to avoid costly mistakes.
Prototyping vs. Production
Prototyping at different facilities than where full-scale production takes place can lead to quality issues in mass production. Mike pointed out that transitioning from prototype to production often requires extra time to ensure designs are fully optimized, emphasizing that quick-turn facilities may not meet high-volume standards.
Ultimately, fostering effective communication and understanding between designers and suppliers is vital for minimizing defects and achieving successful product outcomes.
Mike Tucker stressed the importance of strong collaboration between designers, manufacturers, and assemblers to address challenges at each stage of the PCB production process, ensuring reliable, high-quality outcomes. Mike and host Tech Consultant Zach Peterson discuss the most common clashes between HDI design and manufacturing, how to avoid costly errors, and why understanding fabrication processes is crucial for your PCB success. Whether you’re dealing with Class 2, Class 3, or beyond, Mike offers practical solutions to streamline your design-to-production journey.
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